H1B Atlas
A

Avery Dennison Corporation

LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023

HQ: Mentor, OH
NAICS: 33994

No Elevated Filing Signal

No elevated signal appears in the currently matched LCA and USCIS datasets. This is descriptive filing history, not immigration, legal, or employment advice.

Median Base Salary

$159,200

H-1B LCA Filings

13LCA records

USCIS I-129 History

100%
Higher approval share

PERM Filings

6filings

Sponsorship Filing Signals

PERM Activity Ratio

32%

This is not an individual green-card conversion or success rate. It compares the employer PERM filing volume with H-1B LCA filing volume in the available public datasets.

Compensation Value

104% of Industry Median

The filed median base wage is at or above the peer industry baseline used here.

Data caveat

Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits. The PERM Activity Ratio shown here is descriptive filing activity, not a green-card success or conversion rate.

Salary Distribution (Base)

Distribution is not available for this page because the source filings do not include enough complete salary observations.

Top Job Titles

Top Locations

Frequently Asked Questions

What is the median H1B salary at Avery Dennison Corporation?
The median filed base salary for H-1B LCA records at Avery Dennison Corporation is $159,200.
How many H-1B LCA filings did Avery Dennison Corporation submit?
Avery Dennison Corporation filed 13 Labor Condition Applications in the available LCA dataset.
What PERM activity is observed for Avery Dennison Corporation?
Avery Dennison Corporation has 6 PERM filings in the available PERM dataset. This is not an individual green-card success rate.
What are the most common H1B roles at Avery Dennison Corporation?
The most common H1B roles at Avery Dennison Corporation include: Data Engineer, Product Manager, Firmware Engineer.