H1B Atlas
B

BrainCo Technologies, Inc.

LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023

HQ: San Francisco, CA
NAICS: 541511

No Elevated Filing Signal

No elevated signal appears in the currently matched LCA and USCIS datasets. This is descriptive filing history, not immigration, legal, or employment advice.

Median Base Salary

N/A

H-1B LCA Filings

8LCA records

USCIS I-129 History

N/A
Higher denial signal

PERM Filings

0filings

Sponsorship Filing Signals

PERM Activity Ratio

0%

This is not an individual green-card conversion or success rate. It compares the employer PERM filing volume with H-1B LCA filing volume in the available public datasets.

Compensation Value

Not enough salary data

The source filings do not include enough complete salary observations to compare this employer against the industry median.

Data caveat

Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits. The PERM Activity Ratio shown here is descriptive filing activity, not a green-card success or conversion rate.

Salary Distribution (Base)

Distribution is not available for this page because the source filings do not include enough complete salary observations.

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Frequently Asked Questions

What is the median H1B salary at BrainCo Technologies, Inc.?
The median filed base salary for H-1B LCA records at BrainCo Technologies, Inc. is N/A.
How many H-1B LCA filings did BrainCo Technologies, Inc. submit?
BrainCo Technologies, Inc. filed 8 Labor Condition Applications in the available LCA dataset.
What PERM activity is observed for BrainCo Technologies, Inc.?
BrainCo Technologies, Inc. has 0 PERM filings in the available PERM dataset. This is not an individual green-card success rate.
What are the most common H1B roles at BrainCo Technologies, Inc.?
The most common H1B roles at BrainCo Technologies, Inc. include: AI Platform Engineer, Product Designer, AI Due Diligence Principal.