What is the average H1B salary for a Firmware Engineer II?

The median filed base salary for Firmware Engineer II H-1B LCA records is N/A per year.

How many Firmware Engineer II H-1B LCA filings are in this dataset?

There are 12 Labor Condition Applications filed for the Firmware Engineer II role in the available dataset.

Which employers file H-1B LCAs for Firmware Engineer II?

Top employers filing LCAs for Firmware Engineer II include Toyota Material Handling Inc., Milwaukee Electric Tool Corporation, RESIDEO LLC.

Firmware Engineer II

SOC Code: 17-2071.00

SOC Category: Electrical Engineers

LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023

Median Salary

N/A

H-1B LCA Filings

12LCA records

Top 10% Salary

N/A

Data caveat

Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits.

Salary Distribution (Base)

Distribution is not available for this page because the source filings do not include enough complete salary observations.

Top Sponsoring Employers

Toyota Material Handling Inc.10 filings
N/A
Milwaukee Electric Tool Corporation1 filings
$108,150
RESIDEO LLC1 filings
$122,920

Highest Paying Cities

AURORA, IL1 filings
$122,920
Chicago, IL1 filings
$108,150
Greene, NY10 filings
N/A

Frequently Asked Questions

What is the average H1B salary for a Firmware Engineer II?: The median filed base salary for Firmware Engineer II H-1B LCA records is N/A per year.
How many Firmware Engineer II H-1B LCA filings are in this dataset?: There are 12 Labor Condition Applications filed for the Firmware Engineer II role in the available dataset.
Which employers file H-1B LCAs for Firmware Engineer II?: Top employers filing LCAs for Firmware Engineer II include: Toyota Material Handling Inc., Milwaukee Electric Tool Corporation, RESIDEO LLC.