Principal Engineer, Hardware Development Engineering
SOC Code: 17-2112.03
SOC Category: Manufacturing Engineers
LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023
Macro Wage Baseline (BLS OEWS May 2023)
+56.7%
Filed H-1B base wages show $155,750 vs BLS national median $99,380
Median Salary
$155,750
H-1B LCA Filings
10LCA records
Top 10% Salary
$178,651
Data caveat
Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits.
Salary Distribution (Base)
$155,750
P25: $155,043
P75: $178,651
Min: $147,447Max: $178,651
Top Sponsoring Employers
- Western Digital Technologies, Inc.10 filings$155,750
Highest Paying Cities
- San Jose, CA3 filings$178,651
- Fremont, CA4 filings$167,201
- Union City, CA1 filings$155,750
- Milpitas, CA2 filings$151,245
Frequently Asked Questions
- What is the average H1B salary for a Principal Engineer, Hardware Development Engineering?
- The median filed base salary for Principal Engineer, Hardware Development Engineering H-1B LCA records is $155,750 per year.
- How many Principal Engineer, Hardware Development Engineering H-1B LCA filings are in this dataset?
- There are 10 Labor Condition Applications filed for the Principal Engineer, Hardware Development Engineering role in the available dataset.
- Which employers file H-1B LCAs for Principal Engineer, Hardware Development Engineering?
- Top employers filing LCAs for Principal Engineer, Hardware Development Engineering include: Western Digital Technologies, Inc..