R&D Engineer IC Design
SOC Code: 17-2072.00
SOC Category: Electronics Engineers, Except Computer
LCA FY2024-FY2026 · PERM FY2024-FY2025 · USCIS Employer Data Hub 2023 · BLS OEWS May 2023
Macro Wage Baseline (BLS OEWS May 2023)
+77.9%
Filed H-1B base wages show $204,901 vs BLS national median $115,210
Median Salary
$204,901
H-1B LCA Filings
36LCA records
Top 10% Salary
N/A
Data caveat
Public filing data is normalized for browsing. LCA filings are not visa approvals or job openings, PERM filings are not individual green-card success rates, and salary figures generally exclude equity, bonus, and benefits.
Salary Distribution (Base)
Distribution is not available for this page because the source filings do not include enough complete salary observations.
Top Sponsoring Employers
- Broadcom Corporation21 filings$200,839
- LSI Corporation8 filingsN/A
- Avago Technologies US Inc.7 filings$216,091
Highest Paying Cities
- San Jose, CA24 filings$216,091
- Irvine, CA6 filings$173,930
- San Diego, CA2 filings$171,538
- Andover, MA2 filings$139,239
- Colorado Springs, CO1 filings$131,186
- Chandler, AZ1 filingsN/A
Frequently Asked Questions
- What is the average H1B salary for a R&D Engineer IC Design?
- The median filed base salary for R&D Engineer IC Design H-1B LCA records is $204,901 per year.
- How many R&D Engineer IC Design H-1B LCA filings are in this dataset?
- There are 36 Labor Condition Applications filed for the R&D Engineer IC Design role in the available dataset.
- Which employers file H-1B LCAs for R&D Engineer IC Design?
- Top employers filing LCAs for R&D Engineer IC Design include: Broadcom Corporation, LSI Corporation, Avago Technologies US Inc..